ninth Gen Intel X-series CPUs coming in November, with as much as 18 cores of soldered silicon
Intel has formally introduced model new X-series CPUs. These HEDT (high-end desktop) processors are set to launch in November, and have a return to soldered TIM (thermal interface materials) for higher temps and better overclocking potential, as much as 68-lanes of PCIe 3.0, and as much as 18-cores of computational energy. The new chips make...









