Oracle^® Flash Accelerator F640 PCIe Card User Guide

PCIe Gen3 half-height, half-width, single-slot x8 connector

Low-profile, half-height, and half-length PCIe 3.1 board

PCIe interface that complies with the PCI Express Base Specification 3.1

PCI low-profile MD2 specification

Add-in card (AIC) form factor

Single slot x8 connector

Half-height, half-width, half-length, low-profile PCIe 3.1 board

Sequential read speeds of up to 6.5 GB/second

Sequential write speeds of up to 3.1 GB/second

Random read IOPS of 1379K for 4 KB operations.

Random write IOPS of 428K for 4 KB operations.

High-endurance Intel TLC 3D NAND flash memory 32-tier

Two Intel flash memory NVMe controller ASICs

Uncorrectable Bit Error Rate (UBER): 1 sector per 10¹⁷ bits read

Mean Time Between Failure (MTBF): 2 million hours

T10 DIF (data integrity field) end-to-end data protection

3.3V and 12V supply rail

Active/Idle (typical): Up to 25W/4W (typical)

Max Average Current: 2.1A (12V), 3.0A (3.3V)

Enhanced power-loss data protection

Oracle Flash Accelerator F640 PCIe Cards support NVMe specifications for RTD3 Resume Latency and RTD3 Entry Latency. RTD3R Resume latency allows 7.5 seconds of margin for devices to safely start before main power is applied to the device controller. RTD3E Entry latency allows 6 seconds of margin for active devices to safely shutdown before main power is removed from the device controller.

Compliance Model: SSDPECKE064T7

NVM Express 1.2b

PCI Express Base Specification Rev 3.1

Enterprise SSD Form Factor Version 1.0a

PCI Express Card Electro-Mechanical (CEM) Specification Rev 3.0

Up to 34.7 PBW (petabytes written)

2.95 Drive Writes/day (JESD219 workload)

Operating: -1,000 to 10,000 ft

Non-operating: -1,000 to 40,000 ft

Operating:

• 0 to 55°C ambient, with specified airflow out of server through PCIe card slot

• Temperature monitoring (in-band and by way of SMBUS)

• Thermal throttling

Non-operating: -55 to 95°C

Operating: 2.17 GRMS (5-700Hz)

Non-operating: 3.13 GRMS (5-800Hz)